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2SK2003-01MR N-CHANNEL SILICON POWER MOSFET Features High speed switching Low on-resistance No secondary breakdown Low driving power High voltage www..com VGS=30V Guarantee Avalanche-proof FUJI POWER MOSFET FAP-IIA SERIES Outline Drawings TO-220F15 Applications Switching regulators UPS DC-DC converters General purpose power amplifier 2.54 3. Source JEDEC EIAJ SC-67 Maximum ratings and characteristics Absolute maximum ratings ( Tc=25C unless otherwise specified) Item Drain-source voltage Continuous drain current Pulsed drain current Continuous reverse drain current Gate-source peak voltage Max. power dissipation Operating and storage temperature range Symbol VDS ID ID(puls] IDR VGS PD Tch Tstg Rating 600 4 16 4 30 40 +150 -55 to +150 Unit V A A A V W C C Equivalent circuit schematic Drain(D) Gate(G) Source(S) Electrical characteristics (Tc =25C unless otherwise specified) Item Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current Gate-source leakage current Drain-source on-state resistance Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on time ton (ton=td(on)+tr) Turn-off time toff (toff=td(off)+tf) Avalanche capability Diode forward on-voltage Reverse recovery time Reverse recovery charge Symbol V(BR)DSS VGS(th) IDSS IGSS RDS(on) gfs Ciss Coss Crss td(on) tr td(off) tf IAV VSD trr Qrr Test Conditions ID=1mA VGS=0V ID=1mA VDS=VGS VDS=600V VGS=0V VGS=30V VDS=0V ID=2A VGS=10V ID=2A VDS=25V VDS=25V VGS=0V f=1MHz VCC=300V RG=10 ID=4A VGS=10V L=100H Tch=25C IF=2xIDR VGS=0V Tch=25C IF=IDR VGS=0V -di/dt=100A/s Tch=25C Min. 600 2.5 Tch=25C Tch=125C Typ. 3.0 10 0.2 10 2.0 4 1000 85 20 20 15 45 15 1.1 400 2 Max. 3.5 500 1.0 100 2.4 1500 130 30 30 25 70 25 1.65 Units V V A mA nA S pF 2 ns A V ns C 4 Thermal characteristics Item Thermal resistance Symbol Rth(ch-a) Rth(ch-c) Test Conditions channel to ambient channel to case Min. Typ. Max. 62.5 3.125 Units C/W C/W 1 FUJI POWER MOSFET Characteristics Typical output characteristics 8 10 2SK2003-01MR On state resistance vs. Tch 8 RDS(on) [] 6 ID [A] 6 4 www..com 4 2 2 0 0 4 8 12 16 20 24 28 32 VDS [ V ] 0 -50 0 50 Tch [ C ] 100 150 Typical transfer characteristics 10 8 Typical Drain-Source on state resistance vs. ID 8 6 6 ID [A] 4 RDS(on) [] 4 2 2 0 0 2 4 6 VGS [ V ] 8 10 0 0 2 ID [ A ] 4 6 Typical forward transconductance vs. ID 10 5.0 Gate threshold voltage vs. Tch 8 4.0 6 gfs [S] 4 3.0 VGS(th) [V] 2.0 2 1.0 0 0 2 4 ID [ A ] 6 8 10 0 -50 0 50 Tch [ C ] 100 150 2 FUJI POWER MOSFET Typical capacitance vs. VDS 101 500 2SK2003-01MR Typical input charge 25 400 100 C [nF] 20 VDS 300 [V] 15 VGS [V] 10 200 www..com 10-1 100 5 10-2 0 10 20 VDS [ V ] 30 40 0 0 10 20 30 40 50 0 Qg [ nC ] Forward characteristics of reverse diode 10 1 Allowable power dissipation vs. Tc 60 50 100 IF [A] 10-1 40 PD 30 [W] 20 10 10-2 0 0.5 VSD [ V ] 1.0 1.5 0 0 50 Tc [ C ] 100 150 Safe operating area 102 Transient thermal impedance 101 100 Rth [C/W] 10-1 10-1 ID [A] 100 10-2 10-5 10-4 10-3 10-2 t [ sec. ] 10-1 100 101 10-2 0 10 101 102 VDS [ V ] 103 3 |
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